Pro Clima PRIMER RP Solvent-free primer, no drying required 750ml

TESCON^® PRIMER RP is applied to porous substrates to prepare the surface for optimum adhesion of TESCON^® VANA, TESCON^® PROFIL, TESCON EXTORA^®, TESCON EXTORA^® PROFIL & TESCON EXTOSEAL^®. Use TESCON® PRIMER RP to prime substrates such as timber flooring, masonry, fibre cement, plywood, oriented strand board (OSB), and other porous or friable surfaces prior to application of pro clima tapes. This product is designed to enhance adhesion to porous substrates and allow for a highly durable airtight seal and is suitable for bonding all pro clima tape products to any porous or friable building material.

• Very high adhesion
• No drying required prior to application of tapes
• Deep penetration into the substrate & excellent hardening
• Application on damp surfaces is possible
• Solvent free

APPLICATION: No drying required. Prior to bonding tapes such as TESCON® VANA, TESCON EXTORA® or TESCON EXTOSEAL® use TESCON® PRIMER RP to prime substrates such as timber flooring, masonry, fibre cement, osb and other porous surfaces.

ADVANTAGES: No drying required – adhesive can be applied straight to the damp primer on absorbent substrates; application even on damp substrate; can also be used in belowzero conditions; can be used with any pro clima adhesive tape; solvent free.